Gómez Gómez, Adriana 
; Recco, Abel André Cândido ; Lima, N B; Martinez, L G; Tschiptschin, André Paulo ; Souza, Roberto Martins de
Source: Surface & Coatings Technology. Unidade: EP
Subjects: DIFRAÇÃO POR RAIOS X, TITÂNIO, FILMES FINOS
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GÓMEZ GÓMEZ, Adriana et al. Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition. Surface & Coatings Technology, v. 204, n. 20, p. 3228-3233, 2010Tradução . . Disponível em: https://doi.org/10.1016/j.surfcoat.2010.03.016. Acesso em: 04 jun. 2024.APA
Gómez Gómez, A., Recco, A. A. C., Lima, N. B., Martinez, L. G., Tschiptschin, A. P., & Souza, R. M. de. (2010). Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition. Surface & Coatings Technology, 204( 20), 3228-3233. doi:10.1016/j.surfcoat.2010.03.016NLM
Gómez Gómez A, Recco AAC, Lima NB, Martinez LG, Tschiptschin AP, Souza RM de. Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition [Internet]. Surface & Coatings Technology. 2010 ; 204( 20): 3228-3233.[citado 2024 jun. 04 ] Available from: https://doi.org/10.1016/j.surfcoat.2010.03.016Vancouver
Gómez Gómez A, Recco AAC, Lima NB, Martinez LG, Tschiptschin AP, Souza RM de. Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition [Internet]. Surface & Coatings Technology. 2010 ; 204( 20): 3228-3233.[citado 2024 jun. 04 ] Available from: https://doi.org/10.1016/j.surfcoat.2010.03.016
