Shang, Xiaogang; Brandi, Sérgio Duarte 
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SHANG, Xiaogang e BRANDI, Sérgio Duarte. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate. 2005, Anais.. Kolkata: The Indian Institute of Welding, 2005. Disponível em: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf. Acesso em: 19 abr. 2024.APA
Shang, X., & Brandi, S. D. (2005). Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate. In . Kolkata: The Indian Institute of Welding. Recuperado de https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdfNLM
Shang X, Brandi SD. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate [Internet]. 2005 ;[citado 2024 abr. 19 ] Available from: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdfVancouver
Shang X, Brandi SD. Contact angle and it's dynamic variation during the process of spreading of sn, Bi, and some lead-free solders over copper substrate [Internet]. 2005 ;[citado 2024 abr. 19 ] Available from: https://repositorio.usp.br/directbitstream/c06f71af-c050-46fe-a34c-a7c019914017/BRANDI-2005-1428079-Contactangle.pdf
