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  • Source: Solid State Electronics. Unidade: EP

    Subjects: TRANSISTORES, CIRCUITOS ANALÓGICOS, SEMICONDUTORES

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      PERINA, Welder Fernandes et al. Experimental study of MISHEMT from 450 K down to 200 K for analog applications. Solid State Electronics, v. 208, p. 1-4, 2023Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2023.108742. Acesso em: 06 jun. 2024.
    • APA

      Perina, W. F., Martino, J. A., Simoen, E., Peralagu, U., Collaert, N., & Agopian, P. G. D. (2023). Experimental study of MISHEMT from 450 K down to 200 K for analog applications. Solid State Electronics, 208, 1-4. doi:10.1016/j.sse.2023.108742
    • NLM

      Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. Experimental study of MISHEMT from 450 K down to 200 K for analog applications [Internet]. Solid State Electronics. 2023 ; 208 1-4.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2023.108742
    • Vancouver

      Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. Experimental study of MISHEMT from 450 K down to 200 K for analog applications [Internet]. Solid State Electronics. 2023 ; 208 1-4.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2023.108742
  • Source: Solid State Electronics. Unidade: EP

    Subjects: TRANSISTORES, TEMPERATURA, NANOTECNOLOGIA, CIRCUITOS ANALÓGICOS, CIRCUITOS DIGITAIS

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      SILVA, V C P et al. Evaluation of n-type gate-all-around vertically-stacked nanosheet FETs from 473 K down to 173 K for analog applications. Solid State Electronics, v. 208, p. 1-5, 2023Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2023.108729. Acesso em: 06 jun. 2024.
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      Silva, V. C. P., Martino, J. A., Simoen, E., Veloso, A., & Agopian, P. G. D. (2023). Evaluation of n-type gate-all-around vertically-stacked nanosheet FETs from 473 K down to 173 K for analog applications. Solid State Electronics, 208, 1-5. doi:10.1016/j.sse.2023.108729
    • NLM

      Silva VCP, Martino JA, Simoen E, Veloso A, Agopian PGD. Evaluation of n-type gate-all-around vertically-stacked nanosheet FETs from 473 K down to 173 K for analog applications [Internet]. Solid State Electronics. 2023 ;208 1-5.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2023.108729
    • Vancouver

      Silva VCP, Martino JA, Simoen E, Veloso A, Agopian PGD. Evaluation of n-type gate-all-around vertically-stacked nanosheet FETs from 473 K down to 173 K for analog applications [Internet]. Solid State Electronics. 2023 ;208 1-5.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2023.108729
  • Source: Solid State Electronics. Unidade: EP

    Subjects: TRANSISTORES, CIRCUITOS ANALÓGICOS, TEMPERATURA

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      PERINA, Welder Fernandes et al. Experimental study of MISHEMT from 450k down to 200 k for analog applications. Solid State Electronics, v. 208, p. 1-4, 2023Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2023.108742. Acesso em: 06 jun. 2024.
    • APA

      Perina, W. F., Martino, J. A., Simoen, E., Peralagu, U., Collaert, N., & Agopian, P. G. D. (2023). Experimental study of MISHEMT from 450k down to 200 k for analog applications. Solid State Electronics, 208, 1-4. doi:10.1016/j.sse.2023.108742
    • NLM

      Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. Experimental study of MISHEMT from 450k down to 200 k for analog applications [Internet]. Solid State Electronics. 2023 ; 208 1-4.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2023.108742
    • Vancouver

      Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. Experimental study of MISHEMT from 450k down to 200 k for analog applications [Internet]. Solid State Electronics. 2023 ; 208 1-4.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2023.108742
  • Source: SBMicro. Conference titles: Symposium on Microelectronics Technology and Devices. Unidade: EP

    Subjects: TRANSISTORES, SEMICONDUTORES

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      PERINA, Welder Fernandes et al. Study of the effect of multiple conductions on threshold voltage in a MIS-HEMT from 450 K down to 200 K. 2023, Anais.. [Piscataway, N.J.]: IEEE, 2023. Disponível em: https://doi.org/10.1109/SBMicro60499.2023.10302604. Acesso em: 06 jun. 2024.
    • APA

      Perina, W. F., Martino, J. A., Simoen, E., Peralagu, U., Collaert, N., & Agopian, P. G. D. (2023). Study of the effect of multiple conductions on threshold voltage in a MIS-HEMT from 450 K down to 200 K. In SBMicro. [Piscataway, N.J.]: IEEE. doi:10.1109/SBMicro60499.2023.10302604
    • NLM

      Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. Study of the effect of multiple conductions on threshold voltage in a MIS-HEMT from 450 K down to 200 K [Internet]. SBMicro. 2023 ;[citado 2024 jun. 06 ] Available from: https://doi.org/10.1109/SBMicro60499.2023.10302604
    • Vancouver

      Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. Study of the effect of multiple conductions on threshold voltage in a MIS-HEMT from 450 K down to 200 K [Internet]. SBMicro. 2023 ;[citado 2024 jun. 06 ] Available from: https://doi.org/10.1109/SBMicro60499.2023.10302604
  • Source: Semiconductor Science and Technology. Unidade: EP

    Subjects: TRANSISTORES, SEMICONDUTORES

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      CANALES, Bruno Godoy et al. MISHEMT intrinsic voltage gain under multiple channel output characteristics. Semiconductor Science and Technology, v. 38, n. 11, p. 1-6, 2023Tradução . . Disponível em: https://doi.org/10.1088/1361-6641/acfa1f. Acesso em: 06 jun. 2024.
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      Canales, B. G., Perina, W. F., Martino, J. A., Simoen, E., Peralagu, U., Collaert, N., & Agopian, P. G. D. (2023). MISHEMT intrinsic voltage gain under multiple channel output characteristics. Semiconductor Science and Technology, 38( 11), 1-6. doi:10.1088/1361-6641/acfa1f
    • NLM

      Canales BG, Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. MISHEMT intrinsic voltage gain under multiple channel output characteristics [Internet]. Semiconductor Science and Technology. 2023 ; 38( 11): 1-6.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/acfa1f
    • Vancouver

      Canales BG, Perina WF, Martino JA, Simoen E, Peralagu U, Collaert N, Agopian PGD. MISHEMT intrinsic voltage gain under multiple channel output characteristics [Internet]. Semiconductor Science and Technology. 2023 ; 38( 11): 1-6.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/acfa1f
  • Source: Solid State Electronics. Unidade: EP

    Subjects: NANOTECNOLOGIA, CIRCUITOS ANALÓGICOS, TRANSISTORES

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      SOUSA, Julia Cristina Soares et al. Design of operational transconductance amplifier with gate-all-around nanosheet MOSFET using experimental data from room temperature to 200°C. Solid State Electronics, v. 189, p. 1-9, 2022Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2022.108238. Acesso em: 06 jun. 2024.
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      Sousa, J. C. S., Perina, W. F., Rangel, R., Simoen, E., Veloso, A., Martino, J. A., & Agopian, P. G. D. (2022). Design of operational transconductance amplifier with gate-all-around nanosheet MOSFET using experimental data from room temperature to 200°C. Solid State Electronics, 189, 1-9. doi:10.1016/j.sse.2022.108238
    • NLM

      Sousa JCS, Perina WF, Rangel R, Simoen E, Veloso A, Martino JA, Agopian PGD. Design of operational transconductance amplifier with gate-all-around nanosheet MOSFET using experimental data from room temperature to 200°C [Internet]. Solid State Electronics. 2022 ;189 1-9.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2022.108238
    • Vancouver

      Sousa JCS, Perina WF, Rangel R, Simoen E, Veloso A, Martino JA, Agopian PGD. Design of operational transconductance amplifier with gate-all-around nanosheet MOSFET using experimental data from room temperature to 200°C [Internet]. Solid State Electronics. 2022 ;189 1-9.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2022.108238
  • Source: Solid State Electronics. Unidade: EP

    Subjects: NANOELETRÔNICA, DNA

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      MORI, Carlos Augusto Bergfeld et al. Signal to noise ratio in nanoscale bioFETs. Solid State Electronics, v. 194, p. 1-4, 2022Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2022.108358. Acesso em: 06 jun. 2024.
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      Mori, C. A. B., Martens, K., Simoen, E., Van Dorpe, P., Agopian, P. G. D., & Martino, J. A. (2022). Signal to noise ratio in nanoscale bioFETs. Solid State Electronics, 194, 1-4. doi:10.1016/j.sse.2022.108358
    • NLM

      Mori CAB, Martens K, Simoen E, Van Dorpe P, Agopian PGD, Martino JA. Signal to noise ratio in nanoscale bioFETs [Internet]. Solid State Electronics. 2022 ; 194 1-4.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2022.108358
    • Vancouver

      Mori CAB, Martens K, Simoen E, Van Dorpe P, Agopian PGD, Martino JA. Signal to noise ratio in nanoscale bioFETs [Internet]. Solid State Electronics. 2022 ; 194 1-4.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2022.108358
  • Source: Journal of Integrated Circuits and Systems. Unidade: EP

    Subjects: TRANSISTORES, NANOTECNOLOGIA, BAIXA TEMPERATURA

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      SILVA, Vanessa Cristina Pereira da et al. Experimental analysis of trade-off between transistor efficiency and unit gain frequency of nanosheet NMOSFET down to -100°C. Journal of Integrated Circuits and Systems, v. 17, n. 1, p. 1-6, 2022Tradução . . Disponível em: https://doi.org/10.29292/jics.v17il.550. Acesso em: 06 jun. 2024.
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      Silva, V. C. P. da, Leal, J. V. da C., Perina, W. F., Martino, J. A., Simoen, E., Veloso, A., & Agopian, P. G. D. (2022). Experimental analysis of trade-off between transistor efficiency and unit gain frequency of nanosheet NMOSFET down to -100°C. Journal of Integrated Circuits and Systems, 17( 1), 1-6. doi:10.29292/jics.v17i1.550
    • NLM

      Silva VCP da, Leal JV da C, Perina WF, Martino JA, Simoen E, Veloso A, Agopian PGD. Experimental analysis of trade-off between transistor efficiency and unit gain frequency of nanosheet NMOSFET down to -100°C [Internet]. Journal of Integrated Circuits and Systems. 2022 ;17( 1): 1-6.[citado 2024 jun. 06 ] Available from: https://doi.org/10.29292/jics.v17il.550
    • Vancouver

      Silva VCP da, Leal JV da C, Perina WF, Martino JA, Simoen E, Veloso A, Agopian PGD. Experimental analysis of trade-off between transistor efficiency and unit gain frequency of nanosheet NMOSFET down to -100°C [Internet]. Journal of Integrated Circuits and Systems. 2022 ;17( 1): 1-6.[citado 2024 jun. 06 ] Available from: https://doi.org/10.29292/jics.v17il.550
  • Source: Solid State Electronics. Unidade: EP

    Subjects: TRANSISTORES, ALTA TEMPERATURA

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      SILVA, Vanessa Cristina Pereira da et al. Trade-off analysis between gm/ID and fT of nanosheet NMOS transistors with different metal gate stack at high temperature. Solid State Electronics, v. 191, p. 1-8, 2022Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2022.108267. Acesso em: 06 jun. 2024.
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      Silva, V. C. P. da, Martino, J. A., Simoen, E., Veloso, A., & Agopian, P. G. D. (2022). Trade-off analysis between gm/ID and fT of nanosheet NMOS transistors with different metal gate stack at high temperature. Solid State Electronics, 191, 1-8. doi:10.1016/j.sse.2022.108267
    • NLM

      Silva VCP da, Martino JA, Simoen E, Veloso A, Agopian PGD. Trade-off analysis between gm/ID and fT of nanosheet NMOS transistors with different metal gate stack at high temperature [Internet]. Solid State Electronics. 2022 ;191 1-8.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2022.108267
    • Vancouver

      Silva VCP da, Martino JA, Simoen E, Veloso A, Agopian PGD. Trade-off analysis between gm/ID and fT of nanosheet NMOS transistors with different metal gate stack at high temperature [Internet]. Solid State Electronics. 2022 ;191 1-8.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2022.108267
  • Source: Semiconductor Science and Technology. Unidade: EP

    Assunto: SEMICONDUTORES

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      MARTINO, Márcio Dalla Valle et al. Performance of differential pair circuits designed with line tunnel FET devices at different temperatures. Semiconductor Science and Technology, v. 33, n. 7, p. 075012, 2018Tradução . . Disponível em: https://doi.org/10.1088/1361-6641/aac4fd. Acesso em: 06 jun. 2024.
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      Martino, M. D. V., Claeys, C., Agopian, P. G. D., Rooyackers, R., Simoen, E., & Martino, J. A. (2018). Performance of differential pair circuits designed with line tunnel FET devices at different temperatures. Semiconductor Science and Technology, 33( 7), 075012. doi:10.1088/1361-6641/aac4fd
    • NLM

      Martino MDV, Claeys C, Agopian PGD, Rooyackers R, Simoen E, Martino JA. Performance of differential pair circuits designed with line tunnel FET devices at different temperatures [Internet]. Semiconductor Science and Technology. 2018 ; 33( 7): 075012.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/aac4fd
    • Vancouver

      Martino MDV, Claeys C, Agopian PGD, Rooyackers R, Simoen E, Martino JA. Performance of differential pair circuits designed with line tunnel FET devices at different temperatures [Internet]. Semiconductor Science and Technology. 2018 ; 33( 7): 075012.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/aac4fd
  • Source: Semiconductor Science and Technology. Unidades: EP, EACH

    Subjects: TEMPERATURA, SEMICONDUTORES

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      CAPARROZ, Luís Felipe Vicentis et al. Analysis of proton irradiated n- and p-type strained FinFETs at low temperatures down to 100 K. Semiconductor Science and Technology, v. 33, n. 6, p. 065003, 2018Tradução . . Disponível em: https://doi.org/10.1088/1361-6641/aabab3. Acesso em: 06 jun. 2024.
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      Caparroz, L. F. V., Agopian, P. G. D., Claeys, C., Simoen, E., Bordallo, C. C. M., & Martino, J. A. (2018). Analysis of proton irradiated n- and p-type strained FinFETs at low temperatures down to 100 K. Semiconductor Science and Technology, 33( 6), 065003. doi:10.1088/1361-6641/aabab3
    • NLM

      Caparroz LFV, Agopian PGD, Claeys C, Simoen E, Bordallo CCM, Martino JA. Analysis of proton irradiated n- and p-type strained FinFETs at low temperatures down to 100 K [Internet]. Semiconductor Science and Technology. 2018 ; 33( 6): 065003.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/aabab3
    • Vancouver

      Caparroz LFV, Agopian PGD, Claeys C, Simoen E, Bordallo CCM, Martino JA. Analysis of proton irradiated n- and p-type strained FinFETs at low temperatures down to 100 K [Internet]. Semiconductor Science and Technology. 2018 ; 33( 6): 065003.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/aabab3
  • Source: Composants nanoélectroniques. Unidade: EP

    Assunto: SEMICONDUTORES

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      BORDALLO, Caio Cesar Mendes et al. The impact of the temperature on In0.53Ga0.47As nTFETs. Composants nanoélectroniques, v. 18, n. 1, 2018Tradução . . Disponível em: https://doi.org/10.21494/iste.op.2018.0224. Acesso em: 06 jun. 2024.
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      Bordallo, C. C. M., Mocuta, D., Collaert, N., Alian, A., Simoen, E., Claeys, C., et al. (2018). The impact of the temperature on In0.53Ga0.47As nTFETs. Composants nanoélectroniques, 18( 1). doi:10.21494/iste.op.2018.0224
    • NLM

      Bordallo CCM, Mocuta D, Collaert N, Alian A, Simoen E, Claeys C, Agopian PGD, Martino JA, Rooyackers R, Mols Y, Van Dooren A, Verhulst AS, Lin D. The impact of the temperature on In0.53Ga0.47As nTFETs [Internet]. Composants nanoélectroniques. 2018 ;18( 1):[citado 2024 jun. 06 ] Available from: https://doi.org/10.21494/iste.op.2018.0224
    • Vancouver

      Bordallo CCM, Mocuta D, Collaert N, Alian A, Simoen E, Claeys C, Agopian PGD, Martino JA, Rooyackers R, Mols Y, Van Dooren A, Verhulst AS, Lin D. The impact of the temperature on In0.53Ga0.47As nTFETs [Internet]. Composants nanoélectroniques. 2018 ;18( 1):[citado 2024 jun. 06 ] Available from: https://doi.org/10.21494/iste.op.2018.0224
  • Source: Journal of Integrated Circuits and Systems. Unidade: EP

    Assunto: SEMICONDUTORES

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      ITOCAZU, Vitor Tatsuo et al. Ground Plane Influence on Analog Parameters of Different UTBB nMOSFET Technologies. Journal of Integrated Circuits and Systems, v. 12, n. 2, p. 82-88, 2017Tradução . . Disponível em: https://doi.org/10.29292/jics.v12i2.455. Acesso em: 06 jun. 2024.
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      Itocazu, V. T., Sonnenberg, V., Martino, J. A., Simoen, E., & Claeys, C. (2017). Ground Plane Influence on Analog Parameters of Different UTBB nMOSFET Technologies. Journal of Integrated Circuits and Systems, 12( 2), 82-88. doi:10.29292/jics.v12i2.455
    • NLM

      Itocazu VT, Sonnenberg V, Martino JA, Simoen E, Claeys C. Ground Plane Influence on Analog Parameters of Different UTBB nMOSFET Technologies [Internet]. Journal of Integrated Circuits and Systems. 2017 ; 12( 2): 82-88.[citado 2024 jun. 06 ] Available from: https://doi.org/10.29292/jics.v12i2.455
    • Vancouver

      Itocazu VT, Sonnenberg V, Martino JA, Simoen E, Claeys C. Ground Plane Influence on Analog Parameters of Different UTBB nMOSFET Technologies [Internet]. Journal of Integrated Circuits and Systems. 2017 ; 12( 2): 82-88.[citado 2024 jun. 06 ] Available from: https://doi.org/10.29292/jics.v12i2.455
  • Source: Semiconductor Science and Technology. Unidade: EP

    Subjects: TRANSISTORES, SEMICONDUTORES

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      MARTINO, Márcio Dalla Valle et al. Analysis of current mirror circuits designed with line tunnel FET devices at different temperatures. Semiconductor Science and Technology, v. 32, n. 5, p. 055015, 2017Tradução . . Disponível em: https://doi.org/10.1088/1361-6641/aa6764. Acesso em: 06 jun. 2024.
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      Martino, M. D. V., Claeys, C., Rooyackers, R., Simoen, E., Agopian, P. G. D., Vandooren, A., & Martino, J. A. (2017). Analysis of current mirror circuits designed with line tunnel FET devices at different temperatures. Semiconductor Science and Technology, 32( 5), 055015. doi:10.1088/1361-6641/aa6764
    • NLM

      Martino MDV, Claeys C, Rooyackers R, Simoen E, Agopian PGD, Vandooren A, Martino JA. Analysis of current mirror circuits designed with line tunnel FET devices at different temperatures [Internet]. Semiconductor Science and Technology. 2017 ; 32( 5): 055015.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/aa6764
    • Vancouver

      Martino MDV, Claeys C, Rooyackers R, Simoen E, Agopian PGD, Vandooren A, Martino JA. Analysis of current mirror circuits designed with line tunnel FET devices at different temperatures [Internet]. Semiconductor Science and Technology. 2017 ; 32( 5): 055015.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/1361-6641/aa6764
  • Source: IEEE Transactions on Electron Devices. Unidade: EP

    Subjects: MICROELETRÔNICA, SEMICONDUTORES

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      BORDALLO, Caio Cesar Mendes et al. The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs. IEEE Transactions on Electron Devices, v. 64, n. 9, p. 3595-3600, 2017Tradução . . Disponível em: https://doi.org/10.1109/ted.2017.2721110. Acesso em: 06 jun. 2024.
    • APA

      Bordallo, C. C. M., Collaert, N., Claeys, C., Simoen, E., Vandooren, A., Rooyackers, R., et al. (2017). The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs. IEEE Transactions on Electron Devices, 64( 9), 3595-3600. doi:10.1109/ted.2017.2721110
    • NLM

      Bordallo CCM, Collaert N, Claeys C, Simoen E, Vandooren A, Rooyackers R, Mols Y, Alian A, Agopian PGD, Martino JA. The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs [Internet]. IEEE Transactions on Electron Devices. 2017 ; 64( 9): 3595-3600.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1109/ted.2017.2721110
    • Vancouver

      Bordallo CCM, Collaert N, Claeys C, Simoen E, Vandooren A, Rooyackers R, Mols Y, Alian A, Agopian PGD, Martino JA. The Influence of Oxide Thickness and Indium Amount on the Analog Parameters of InxGa1–xAs nTFETs [Internet]. IEEE Transactions on Electron Devices. 2017 ; 64( 9): 3595-3600.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1109/ted.2017.2721110
  • Source: Solid-State Electronics Volume 128, February 2017, Pages 43-47. Conference titles: EUROSOI-ULIS 2016. Unidade: EP

    Assunto: SEMICONDUTORES

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      AGOPIAN, Paula Ghedini Der et al. Study of line-TFET analog performance comparing with other TFET and MOSFET architectures. Solid-State Electronics Volume 128, February 2017, Pages 43-47. [S.l.]: Escola Politécnica, Universidade de São Paulo. Disponível em: https://doi.org/10.1016/j.sse.2016.10.021. Acesso em: 06 jun. 2024. , 2017
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      Agopian, P. G. D., Simoen, E., Vandooren, A., Rooyackers, R., Thean, A., Claeys, C., & Martino, J. A. (2017). Study of line-TFET analog performance comparing with other TFET and MOSFET architectures. Solid-State Electronics Volume 128, February 2017, Pages 43-47. Escola Politécnica, Universidade de São Paulo. doi:10.1016/j.sse.2016.10.021
    • NLM

      Agopian PGD, Simoen E, Vandooren A, Rooyackers R, Thean A, Claeys C, Martino JA. Study of line-TFET analog performance comparing with other TFET and MOSFET architectures [Internet]. Solid-State Electronics Volume 128, February 2017, Pages 43-47. 2017 ; 128 43-47.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2016.10.021
    • Vancouver

      Agopian PGD, Simoen E, Vandooren A, Rooyackers R, Thean A, Claeys C, Martino JA. Study of line-TFET analog performance comparing with other TFET and MOSFET architectures [Internet]. Solid-State Electronics Volume 128, February 2017, Pages 43-47. 2017 ; 128 43-47.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2016.10.021
  • Source: IEEE Transactions on Electron Devices. Unidade: EP

    Subjects: MICROELETRÔNICA, SILÍCIO

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      OLIVEIRA, Alberto Vinicius de et al. Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes. IEEE Transactions on Electron Devices, v. 63, n. 10, p. 4031-4037, 2016Tradução . . Disponível em: https://doi.org/10.1109/ted.2016.2598288. Acesso em: 06 jun. 2024.
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      Oliveira, A. V. de, Simoen, E., Mitard Jerome,, Agopian, P. G. D., Langer, R., Witters, L. J., & Martino, J. A. (2016). Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes. IEEE Transactions on Electron Devices, 63( 10), 4031-4037. doi:10.1109/ted.2016.2598288
    • NLM

      Oliveira AV de, Simoen E, Mitard Jerome, Agopian PGD, Langer R, Witters LJ, Martino JA. Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes [Internet]. IEEE Transactions on Electron Devices. 2016 ; 63( 10): 4031-4037.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1109/ted.2016.2598288
    • Vancouver

      Oliveira AV de, Simoen E, Mitard Jerome, Agopian PGD, Langer R, Witters LJ, Martino JA. Low-Frequency Noise Assessment of Different Ge pFinFET STI Processes [Internet]. IEEE Transactions on Electron Devices. 2016 ; 63( 10): 4031-4037.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1109/ted.2016.2598288
  • Source: Solid-State Electronics. Unidade: EP

    Assunto: TRANSISTORES

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      AOULAICHE, Marc et al. Understanding and optimizing the floating body retention in FDSOI UTBOX. Solid-State Electronics, v. 117, p. 123-129, 2016Tradução . . Disponível em: https://doi.org/10.1016/j.sse.2015.11.021. Acesso em: 06 jun. 2024.
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      Aoulaiche, M., Bourdelle, K. K., Witters, L. J., Caillat, C., Simoen, E., & Martino, J. A. (2016). Understanding and optimizing the floating body retention in FDSOI UTBOX. Solid-State Electronics, 117, 123-129. doi:10.1016/j.sse.2015.11.021
    • NLM

      Aoulaiche M, Bourdelle KK, Witters LJ, Caillat C, Simoen E, Martino JA. Understanding and optimizing the floating body retention in FDSOI UTBOX [Internet]. Solid-State Electronics. 2016 ; 117 123-129.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2015.11.021
    • Vancouver

      Aoulaiche M, Bourdelle KK, Witters LJ, Caillat C, Simoen E, Martino JA. Understanding and optimizing the floating body retention in FDSOI UTBOX [Internet]. Solid-State Electronics. 2016 ; 117 123-129.[citado 2024 jun. 06 ] Available from: https://doi.org/10.1016/j.sse.2015.11.021
  • Source: Semiconductor Science and Technology. Unidade: EP

    Subjects: SEMICONDUTORES, MICROELETRÔNICA

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      OLIVEIRA, Alberto Vinicius de et al. Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes. Semiconductor Science and Technology, v. 31, n. 11, p. 114002 , 2016Tradução . . Disponível em: https://doi.org/10.1088/0268-1242/31/11/114002. Acesso em: 06 jun. 2024.
    • APA

      Oliveira, A. V. de, Agopian, P. G. D., Simoen, E., Langer, R., Collaert, N., Thean, A., et al. (2016). Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes. Semiconductor Science and Technology, 31( 11), 114002 . doi:10.1088/0268-1242/31/11/114002
    • NLM

      Oliveira AV de, Agopian PGD, Simoen E, Langer R, Collaert N, Thean A, Claeys C, Martino JA. Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes [Internet]. Semiconductor Science and Technology. 2016 ; 31( 11): 114002 .[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/0268-1242/31/11/114002
    • Vancouver

      Oliveira AV de, Agopian PGD, Simoen E, Langer R, Collaert N, Thean A, Claeys C, Martino JA. Split CV mobility at low temperature operation of Ge pFinFETs fabricated with STI first and last processes [Internet]. Semiconductor Science and Technology. 2016 ; 31( 11): 114002 .[citado 2024 jun. 06 ] Available from: https://doi.org/10.1088/0268-1242/31/11/114002
  • Source: Journal of Integrated Circuits and Systems. Unidade: EP

    Assunto: SEMICONDUTORES

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      ITOCAZU, Vitor Tatsuo et al. Analytical Model for Threshold Voltage in UTBB SOI MOSFET in Dynamic Threshold Voltage Operation. Journal of Integrated Circuits and Systems, v. 12, n. 2, p. 101-106, 2016Tradução . . Disponível em: https://doi.org/10.29292/jics.v12i2.458. Acesso em: 06 jun. 2024.
    • APA

      Itocazu, V. T., Martino, J. A., Sasaki, K. R. A., Simoen, E., Claeys, C., & Sonnenberg, V. (2016). Analytical Model for Threshold Voltage in UTBB SOI MOSFET in Dynamic Threshold Voltage Operation. Journal of Integrated Circuits and Systems, 12( 2), 101-106. doi:10.29292/jics.v12i2.458
    • NLM

      Itocazu VT, Martino JA, Sasaki KRA, Simoen E, Claeys C, Sonnenberg V. Analytical Model for Threshold Voltage in UTBB SOI MOSFET in Dynamic Threshold Voltage Operation [Internet]. Journal of Integrated Circuits and Systems. 2016 ; 12( 2): 101-106.[citado 2024 jun. 06 ] Available from: https://doi.org/10.29292/jics.v12i2.458
    • Vancouver

      Itocazu VT, Martino JA, Sasaki KRA, Simoen E, Claeys C, Sonnenberg V. Analytical Model for Threshold Voltage in UTBB SOI MOSFET in Dynamic Threshold Voltage Operation [Internet]. Journal of Integrated Circuits and Systems. 2016 ; 12( 2): 101-106.[citado 2024 jun. 06 ] Available from: https://doi.org/10.29292/jics.v12i2.458

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